Advanced Chip Analysis, Microscopy & Circuit Editing

Unlock precision and insight for your integrated circuit projects with our advanced laboratory services. From failure analysis and FIB circuit modification to high-resolution electron microscopy, ADVANCED CIRCUIT ENGINEERS SERVICES, INC delivers cutting-edge microelectronic support trusted by the semiconductor, AI system, and automotive industries.

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Dual-beam FIB-SEM electron microscopy equipment in laboratory setting — Illustrative stock photo · CDC / Pexels

Our Core Services

Dual-Beam FIB-SEM Microscopy

Advanced imaging of micro and nanoscale structures using focused ion beam/scanning electron microscopy (FIB-SEM). Analyze device cross-sections with unparalleled detail for defect inspection, structural analysis, and process validation across semiconductor, automotive, and AI hardware.

Transmission electron microscopy observation of microchip materials — Illustrative stock photo · Marta Branco / Pexels

Transmission Electron Microscopy (TEM)

Ultra-high resolution imaging at the atomic scale with advanced TEM techniques. Reveal phase, grain, and interface properties in nanoelectronics and devices. Our lab provides precise lamella preparation, nanoanalysis, and fast turnaround for R&D and failure investigation.

Engineer performing circuit edit on IC with FIB — Illustrative stock photo · Mikhail Nilov / Pexels

FIB Circuit Edit & Modification

Implement design changes directly on fabricated ICs. Our focused ion beam (FIB) circuit editing enables precise rerouting, open or short fixes, and real-time design debug. Access rapid turnaround without going back to photomask revisions—vital for time-sensitive development.

Failure Analysis

Comprehensive root cause determination for electronic and semiconductor failures. Methods include electrical probing, microscopy, and spectroscopic diagnostics. Whether facing yield loss, performance drift, or intermittent errors, our team uncovers actionable insight to drive corrective action.

Spectroscopy array for semiconductor material analysis — Illustrative stock photo · Tima Miroshnichenko / Pexels

Advanced Spectroscopy

Material characterization at the elemental and molecular level through a variety of spectroscopy approaches—EDS, EELS, and more. Verify composition, contamination, or failure modes in microchips and system-level assemblies to support qualification and compliance.

IC probe testing system for device validation — Illustrative stock photo · tnfeez desgin / Pexels

IC Testing & Validation

Precise electrical validation of ICs and system components. Utilize probe stations, test benches, and measurement equipment to ensure compliance, performance, and reliability before deployment in mission critical applications like AI or automotive electronics.

Industries & Clients

Semiconductor Manufacturers: Accelerate new process development, solve device defects quickly, and reduce time to market.
AI System Designers: Ensure reliability, performance, and rapid iteration for state-of-the-art AI hardware.
Automotive Electronics: Validate chips for automotive safety, robustness, and compliance with functional safety standards.
Research & Academia: Access high-resolution imaging and failure analysis tools for advanced studies of new materials and integrated circuits.
Systems Integrators: Debug boards, analyze interconnects, and verify assemblies pre- and post-field deployment.

How to Select the Right Service

1. Identify Your Goal

Define your project’s immediate need: is it root cause analysis, device modification, characterization, or validation?

2. Assess Device Specifications

Note IC packaging, layer count, sensitive regions, and access constraints. This helps determine imaging or edit method.

3. Prepare Supporting Materials

Gather datasheets, schematics, recent test data, and failure signatures. These enable effective analysis and troubleshooting.

4. Consult Our Engineers

Contact us to discuss your requirements—we’ll recommend the optimum analytical pathway and generate a tailored work plan.

Project Preparation Checklist

Sample Cleanliness: Ensure devices are free of debris and handled according to ESD safety standards.
Documentation: Provide current schematics, failure reports, and suspected problematic regions.
Packaging/Shipping: Package fragile ICs or samples carefully to prevent physical damage in transit.
Clear Communication: Include contact info for your technical lead to enable rapid clarification during processing.

How to Work With Us

Submit Enquiry

Email your project details or call to speak with an engineer. We review your request and suggest next steps.

Project Evaluation

We discuss objectives, timeline, and technical approach. Non-disclosure agreements can be arranged if required.

Sample Submission

You ship or deliver your devices following our packing checklist. We log samples on receipt and assign a project engineer.

Execution & Reporting

Analysis is performed as approved, results are documented and delivered. We provide detailed, actionable reporting with clear next steps.

About ADVANCED CIRCUIT ENGINEERS SERVICES, INC

ADVANCED CIRCUIT ENGINEERS SERVICES, INC is dedicated to providing industry-leading analytical and modification solutions for advanced integrated circuits and systems. With expertise covering failure analysis, focused ion beam (FIB) circuit editing, and state-of-the-art electron microscopy, we support innovation and reliability in semiconductors for AI, automotive, and the broader electronics sector.

Our laboratory combines precision instrumentation, deep technical knowledge, and a commitment to confidentiality. We partner with our clients from consultative project planning through to robust reporting and corrective action support.

Contact Us

Phone: +1 (408) 719-1278
Email: info@arab-engineerng.com
Document: 3691649

For technical enquiries, project submissions, or consultation, please email or call us. Our experienced engineers help assess your needs and propose the most effective analytical pathway. We respond promptly, typically within the next business day.

Office Address:
308 South Abbott Ave
Milpitas, CA 95035

Frequently Asked Questions

What types of devices can you analyze or edit?

We handle a wide range of devices—from advanced logic ICs, memory, power chips, sensors, and ASICs, to multi-chip modules from the semiconductor, AI, and automotive industries. Please provide details of your part for technique suitability.

How do you maintain confidentiality?

All engagements are kept in strict confidence. Non-disclosure agreements (NDAs) are standard and can be executed prior to project discussions.

How fast can you process samples?

Turnaround depends on project complexity, but initial evaluations and standard imaging can be expedited. Discuss your timeline so we can prioritize urgent requests.

What information should I provide with my sample?

Bring or send device identifiers, failure descriptions, electrical/schematic data, and your specific investigation goals. The more information provided, the better tailored our analysis.

Can you help with both process and design-related failures?

Yes. We investigate both process-related defects (contamination, layer issues) and design bugs (routing, shorts/opens) with specialist techniques for each area.

Do you offer device modification (circuit edit) for urgent debug?

Absolutely. FIB circuit edit is one of our specialties—allowing rapid fixes on physically manufactured dice without requiring a new mask build.

Can I visit your laboratory?

Lab visits are arranged by prior appointment and subject to project confidentiality and safety protocols. Please contact us to discuss.